Chip on Board

Chip on Board

40G PCB Optical Engine100G SR10 The high-performance optical interconnect SIP (system in package) or COB (chip on boad) solutions offered by Shucan are achieved by integrations of optical/mechanism design and MEMS processed devices. The solution is made possible via smart mechanism designs and high precision assemblies of optical components (VCSEL/PD), driver IC, Transimpedance Amplifier (TIA), controller, passive components and optical fibers. The SIP can be part of the whole transceiver module otherwise it can be tailored to fit the requirement of different applications, such as enterprise used QSFP, QSFP28, CFP, CFP2, CFP4 SR10 and SR4 transceivers.


  • Board design
  • High accuracy Epoxy diebonding
  • High density wirebonding
  • Active and passive alignment for multi channel micro lens array
  • RF and DC performance testing

HQ and factory: No.127 West Wulian Street, Shuangliu District, Chengdu City, 610200, China.
North America: 24611 Garland Drive, Santa Clarita, CA 91353, USA

  +86 028-67087999
  +86 028-67087979

Technical support: